Low contact resistance:
Multi-point parallel contact reduces contact resistance by 30%–50%.
High stability:
Uniform pressure, strong self-adaptability, minimal oxide film formation, and low resistance fluctuation.
Good heat dissipation:
Gaps between contact fingers form natural heat dissipation channels, resulting in low temperature rise.
Strong short-circuit withstand capability:
Uniform current distribution effectively suppresses contact bounce and can withstand large short-circuit currents.
Self-cleaning effect:
Slight bounce during contact can remove the oxide layer, maintaining good contact.